Whakatakotoranga | |
Huanga | Uara |
Kaihanga: | Winbond |
Kāwai Hua: | NOR Flash |
RoHS: | Nga korero |
Kāhua Whakaeke: | SMD/SMT |
Mōkī / Take: | SOIC-8 |
Rangatū: | W25Q64JV |
Rahi Pūmahara: | 64 Mbit |
Ngaohiko Tuku - Min: | 2.7 V |
Ngaohiko Tuku - Max: | 3.6 V |
Pānui Hohe Onāianei - Mōrahi: | 25 mA |
Momo Atanga: | SPI |
Auautanga Karaka Morahi: | 133 MHz |
Whakahaere: | 8M x 8 |
Raraunga pahi whanui: | 8 moka |
Momo Wā: | Tukutahi |
Paemahana Mahi Iti: | -40C |
Paemahana Mahi Morahi: | + 85 C |
Tapeke: | Paepae |
Waitohu: | Winbond |
Tuku Naianei - Max: | 25 mA |
makuku tairongo: | Ae |
Momo Hua: | NOR Flash |
Te Rahi Wheketere: | 630 |
Kāwairoto: | Te Maharahara me te Rokiroki Raraunga |
Ingoa Hokohoko: | SpiFlash |
Taumaha Waeine: | 0.006349 oz |
Āhuatanga:
* Whanau Hou o nga Maharatanga SpiFlash - W25Q64JV: 64M-bit / 8M-paita
– SPI Paerewa: CLK, /CS, DI, DO
– Tärua SPI: CLK, /CS, IO0, IO1
– Tapawhā SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Tautuhi Pūmanawa me te Pūmārō(1)
* Kohiko Rangatū Mahi Teitei
– 133MHz Takitahi, Takirua/Tawhā SPI karaka
266/532MHz rite Tärua/Tawhā SPI
– Min.100K Porotaka-Muku huringa mo ia wahanga – Neke atu i te 20 tau te pupuri raraunga
* He pai "Panui Tonu"
– Panui Tonu me te 8/16/32/64-Paita Wrap – Kia 8 nga karaka hei whakatika i te mahara
– Whakaaetia te mahi XIP pono (whakahaere i te waahi) – He pai ake te X16 Parallel Flash
* Te Mana Iti, Te Waahanga Waahi Whanui - Kotahi 2.7 ki te 3.6V te tuku
– <1μA Hiko-whakaheke (typ.)
– -40°C ki +85°C awhe mahi
* Hangahanga Hangawari me nga waahanga 4KB
– Rangai Uniform/Paraka te Mumu (4K/32K/64K-Paita) – Papatono 1 ki te 256 paita mo ia wharangi ka taea te whakahoahoa – Te Whakakorea/Te Papatono Whakatarewa me te Whakahou
* Nga waahanga Haumaru Ake
– Tiaki-Tuhi-Tuhi Pūmanawa me te Pūmārō
– Parenga OTP motuhake(1)
– Runga/Raro, Whakaoti i te whakamarumaru huinga – Tiaki huinga Poraka takitahi/Rangai
– 64-Bit ID ahurei mo ia taputapu
– Rēhita Tawhā Ka kitea (SFDP) – Rēhita Haumarutanga 3X256-Paita
– Nga Moka Rēhita Tūnga Hurorirori & Kore-kore
* Mokowā Puka Puka
– 8-pin SOIC 208-mil / VSOP 208-mil
– 8-papa WSON 6x5-mm/8x6-mm, XSON 4x4-mm – 16-titi SOIC 300-mil
– 8-pin PDIP 300-mil
– 24-poi TFBGA 8x6-mm (6x4-poi rarangi)
– 24-poi TFBGA 8x6-mm (6x4/5x5 te huinga poroporo)
– Whakapa atu ki a Winbond mo KGD me etahi atu whiringa